KURODA Tadahiro
(University Professor, Office of University Professor, The University of Tokyo / Chancellor, Prefectural University of Kumamoto)
KURODA Tadahiro
(University Professor, Office of University Professor, The University of Tokyo / Chancellor, Prefectural University of Kumamoto)
TAKENAKA Mitsuru
(Professor, Graduate School of Engineering, The University of Tokyo)
In this technology area, we aim to radically reduce power consumption of semiconductors for information and communication infrastructure. Specifically, we aim to develop semiconductor device and process technologies for ultra-low power logic and memory, innovative transmission hardware technologies that reduce power consumption per communication bit by several orders of magnitude, and materials and implementation methods that achieve highly efficient thermal management. We will also develop highly efficient and reliable power conversion and control circuits, inverter/converter stabilization technology, and other technologies to improve the energy efficiency and reliability of large-scale, complex power grids
<Adopted in FY2023> R&D Project Title | Summary | R&D Period |
---|---|---|
Creation of ultra-wideband virtual impedance circuit for highly reliable and high-power density power converter ITOH Junichi |
(PDF:469KB) | FY2023-FY2026 |
Sense & Drive IC for Energy-Saving of Power Devices TAKAMIYA Makoto |
(PDF:666KB) | FY2023-FY2026 |
3DIC thermal management based on phonon engineering NOMURA Masahiro |
(PDF:668KB) | FY2023-FY2026 |
Performance Balance Engineering for Hetero-integrate 3D CFET SRAM MAEDA Tatsuro |
(PDF:1.09MB) | FY2023-FY2026 |
Spin-functional optoelectronic interface using 0-2D hybrid semiconductors MURAYAMA Akihiro |
(PDF:545KB) | FY2023-FY2026 |
<Adopted in FY2024> R&D Project Title | Summary | R&D Period |
---|---|---|
Development of SiC epitaxial layer growth technology for ultra-high voltage power devices UJIHARA Toru |
(PDF:206KB) | FY2024-FY2027 |
Development of 3D IC Cooling Technology with Ultra-High Thermal Conductivity µLHP Integration Nagano Hosei |
(PDF:274KB) | FY2024-FY2027 |
UP-SiC: Unlocking the Future Potential of Silicon Carbide in Power Electronics * KIMOTO Tsunenobu |
(PDF:602KB) | FY2024-FY2027 |
Heterogeneous Material Integrated MEMS/NEMS-Photonics Platform for Secure Communication (HetMEPS) * NISHIYAMA Nobuhiko |
(PDF:335KB) | FY2024-FY2027 |
*These projects promote collaborative R&D with UK.
<Adopted in FY2024> R&D Project Title | R&D Period |
---|---|
Development of high performance heat conduction sheets by electric field alignment with rotating electrodes INABA Masafumi |
FY2024-FY2025 |
The creation of novel zero-energy-consumption terahertz detector based on the 2D plasmon rectification TANG Chao |
FY2024-FY2025 |
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KANAYAMA Toshihiko | Special Emeritus Advisor, National Institute of Advanced Industrial Science and Technology |
SHIMIZU Toshihisa | Specially Appointed Professor, Professor Emeritus, Tokyo Metropolitan University |
TAKAGI Shinichi | Professor, Faculty of Engineering, The University of Tokyo |
TAKAHASHI Ryo | Chief Senior Researcher, Network Research Institute, National Institute of Information and Communication Technology |
DEGUCHI Jun | Group Manager, Frontier Technology R&D Institute, KIOXIA Corporation |
TORIUMI Akira | Emeritus Professor, The University of Tokyo |
NISHI Hiroaki | Professor, Faculty of Science and Technology, Keio University |
FUJITA Masayuki | Professor, College of Engineering, Kanazawa Institute of Technology |
YAMAOKA Masanao | Department Manager, Research & Development Group, Hitachi, Ltd. |
YUKITA Kazuto | Chief Professor, Eco-Electric Research Center, Aichi Institute of Technology |