LCS-FY2021-PP-17
Survey of Technological Issues in Device Fabrications Processes for Gallium Oxide as a Next-Generation Widegap Semiconductor (Vol. 3):
Investigation of Gallium Oxide MOS Interface Band Alignment
Summary
Gallium oxide (Ga2O3) has been attracting attention as one of the next-generation wide-gap semiconductor device materials. Even though it is expected to be put to practical use as a power device material that can be operated with low energy loss and low production cost, its physical properties have not been fully understood.
In this proposal report, we clarify the band alignment at the interface between Ga2O3 and SiO2, which serves as a gate dielectric, paying particular attention to the effect of heat treatment. The band alignment is a critical parameter that determines the threshold voltage, which is a guide to the gate voltage required for switching metal/oxide/semiconductor field-effect transistors (MOSFETs), and the gate leakage current level, which determines the reliability of the gate dielectric film. The changes in band alignment with heat treatment were investigated by two methods: analyzing ultraviolet photoelectron spectroscopy of a high-quality β-Ga2O3 singlecrystal epitaxial wafer surface, and analyzing the X-ray photoelectron spectroscopy of the annealed stacks with SiO2 deposition on the wafer.
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Related Proposal Papers
- Issues Regarding the Technological Development of Gallium Oxide as a New Wide Bandgap Semiconductor for Electron Devices Applications
- Survey of Technological Issues in Device Fabrications Processes for Gallium Oxide as a Next-Generation Widegap Semiconductor (Vol. 2): Clarification of Energy Band Diagram of Single-Crystalline Gallium Oxides
- Survey of Technological Issues in Device Fabrications Processes for Gallium Oxide as a Next-Generation Widegap Semiconductor