Development of local evaluation method for the mechanical strength of high density multi-layer wiring and three dimensional stacking structures

Research Project Outline

Reliability of integrated semiconductor devices has been an issue of serious importance, since their mechanical characteristics are not clear enough while further densification is going with multi-layer wiring and three dimensional stacking structures. Guidelines for long-term reliability design will be worked out in this study by developing submicron-scale local evaluation mehotds for the mechanical strength of high density wiring and three dimensional LSI.