HOMEScholor>Masaaki Ichiki


【Research Theme】

Nano scale packaging technology for nano electrical components using release, transfer, bonding of thin film capacitors with on nano-lattice control Masaaki Ichiki

Masaaki Ichiki

The University of Tokyo, Department of Precision Engineering, School of Engineering, Associate Professor

The target of this research is to establish the packaging and microsystem technology for the next generation micro electronics devices and its manufacturing processes. We will clarify the high-dielectric constant thin film based on the lattice matching/mismatching techniques including its basic mechanisms. Release, transfer and bonding process will be the most essential factors in the proposed method.

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