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„iˆÏˆõ ¬–ì“c@•ŽO•H‰»ŠwiŠ”jŒÚ–â
–Ø‘º@–΍s–³‹@ÞŽ¿Œ¤‹†ŠŠ’·
–ö“c@”Ž–¾iàjƒtƒ@ƒCƒ“ƒZƒ‰ƒ~ƒbƒNƒXƒZƒ“ƒ^[@ê–±—Ž–

‰^‰cˆÏˆõ’· ˆäŒû@‘׍F “Œ–k‘åŠw–¢—ˆ‰ÈŠw‹Zp‹¤“¯Œ¤‹†ƒZƒ“ƒ^[@•›ƒZƒ“ƒ^[’·E‹³Žö Co-chair Robert H. Wagoner Distinguished Professor of Engineering, Dept. of Materials Science and Engineering, Ohio State University
Earthquake Engineering
‰^‰cˆÏˆõ ’J@˜a•v ‰¡•l‘—§‘åŠwHŠw•”ŒšÝŠw‰È@•‹³Žö Organizer Jonathan Bray Professor, Civil and Environmental Engineering, University of California, Berkeley
ƒXƒs[ƒJ[ “Œ”¨@ˆè¶“Œ‹ž‘åŠwHŠw•”“y–؍HŠw‰È@‹³Žö Speaker Jean-Pierre Bardet Professor, Department of Civil Engineering, University of Southern California
ŽO“c@²Œcœä‹`m‘åŠw‘åŠw‰@—HŠwŒ¤‹†‰È@•‹³Žö Gregory G.Deierlein Associate Professor, Dept.of Civil and Environmental Engineering, Stanford University
Design and Integration of Functional Inorganic Materials
‰^‰cˆÏˆõ ¼Œ´@G²iàjƒtƒ@ƒCƒ“ƒZƒ‰ƒ~ƒbƒNƒXƒZƒ“ƒ^[@•›Š’· Organizer Yet-Ming Chiang Professor of Ceramics, Dept.of Materials Science and Engineering, Massachusetts Institute of Technology
ƒXƒs[ƒJ[ ŠÝ–{@º“Œ‹ž‘åŠw¶ŽY‹ZpŒ¤‹†Š@•‹³Žö Speaker Nesbitt W.Hagood Director, Active Materials and Structures Laboratory, Massachusetts Institute of Technology
“¡–{@³”V‘¾—z—U“diŠ”j@R&DƒZƒ“ƒ^[@ƒ[ƒlƒ‰ƒ‹Eƒ}ƒlƒWƒƒ[ Duane B.Dimos Manager, Ceramics Materials Department Sandia National Laboratories
Manufacturing
‰^‰cˆÏˆõ ‘ëŒû@‹`_•l¼ƒzƒgƒjƒNƒXiŠ”j’†‰›Œ¤‹†Š@ê”CŒ¤‹†ˆõ Organizer James H.Smith Vice President, MEMS Research and Development Transparent Optical, Inc.
ƒXƒs[ƒJ[ •“à@M—Y‰F’ˆŠJ”­Ž–‹Æ’c‰F’ˆŠÂ‹«—˜—pƒVƒXƒeƒ€–{•”@Žå”CŠJ”­•”ˆõ Speaker Gary K.Fedder Associate Professor, Dept.of Electrical and Computer Engineering, Carnegie Mellon University
“n粁@Œ’•v•P˜HH‹Æ‘åŠw‚“xŽY‹Æ‰ÈŠw‹ZpŒ¤‹†Š@•Žè
Biotechnology
‰^‰cˆÏˆõ ŽO—ց@“N¶•“c–ò•iH‹ÆiŠ”jˆã–òŠJ‘ñŒ¤‹†–{•”@ƒŠƒT[ƒ`ƒ}ƒlƒWƒƒ[ Organizer David A.Tirrell Professor, Div.of Chemistry and Chemical Engineering, California Institute of Technology
‹g]@ŒšˆêŽO•H‰»ŠwiŠ”j‰¡•l‘‡Œ¤‹†Š”ñ•½t—̈挤‹†Žº@Žº’·
ƒXƒs[ƒJ[ ”nê@‰ÃM“¿“‡‘åŠw–òŠw•”–òŠw‰È@‹³Žö Speaker Adam P.Arkin Staff Scientist, Physical Biosciences Division, Lawrence Berkeley National Laboratory
Œ´@³•F—‰»ŠwŒ¤‹†Šƒtƒƒ“ƒeƒBƒAŒ¤‹†ƒVƒXƒeƒ€‹ÇŠŽž‹óŠÔ‹@”\@Œ¤‹†ƒ`[ƒ€ƒŠ[ƒ_[ Kathryn Uhrich Associate Professor, Department of Chemistry, Rutgers University
ŽQ‰ÁŒ¤‹†ŽÒ ÔÎ‘ò@‘Œõ “Œ‹ž“d—́iŠ”j‹ZpŒ¤‹†Š“y–؃Oƒ‹[ƒv@“y–Ø‹ZpŽÒ Participant Armand Beaudoin Associate Professor, Dept.of Mechanical and Industrial Engineering, University of Illinois, Urbana-Champaign
”ђˁ@“Ö _ŒË‘åŠwHŠw•”ŒšÝŠw‰È@•‹³Žö Jody Beecher Manager, Chip Development, Ciphergen Biosystems, Inc.
‰Á“¡@¹Žq “ޗǏ—Žq‘åŠw‘åŠw‰@lŠÔ•¶‰»Œ¤‹†‰È@•‹³Žö Kathleen C.Hinge Technical Manager, Xerox Corporation
ŠÝ–{@“N ‹à‘®Þ—¿‹ZpŒ¤‹†Š‘æŒÜŒ¤‹†ƒOƒ‹[ƒv@Žå”CŒ¤‹†Š¯ Keng D.Hsueh Manager, Ford Motor Company
‹ß“¡@³—Y iŠ”j•xŽm’ÊŒ¤‹†Š@Þ—¿‹ZpŒ¤‹†ˆõ Anand Jagota Senior Research Scientist, Central Research and Development, DuPont Company
Ö“¡@‹IŽq –³‹@ÞŽ¿Œ¤‹†Š‘æ‚SŒ¤‹†ƒOƒ‹[ƒv@Œ¤‹†ˆõ Michael Judy MEMS Design Manager, Micromachined Products Division Analog Devices, Inc.
’|’†@”ɐD ‹ãB‘åŠwHŠwŒ¤‹†‰@‰ž—p‰»Šw•”–å@•‹³Žö Carl J.Kempf Senior Development Engineer, Kensington Laboratories, Inc.
“c’†@N”Ž iŠ”jNTTƒf[ƒ^‹ZpŠJ”­–{•”@ƒVƒjƒAƒXƒyƒVƒƒƒŠƒXƒg Philip C. Koenig Associate Director, Industrial Economics and Technology, Office of Naval Research, International Field Office
’J@r•F iŠ”j–L“c’†‰›Œ¤‹†Š“dŽ¥‹CÞ—¿Œ¤‹†Žº@Žå”CŒ¤‹†ˆõ Paul C.McIntyre Assistant Professor, Materials Science and Engineering Department, Stanford University
’Á¼@´s H‹Æ‹Zp‰@‹@ŠB‹ZpŒ¤‹†ŠŠî‘b‹Zp•”@Žå”CŒ¤‹†Š¯ Christopher Muir Senior Engineer, Eastman Kodak Company
’†ŽR@—zˆê ‰F’ˆŠJ”­Ž–‹Æ’c§ŒäE„iŒn‹ZpŒ¤‹†•”@µãٌ¤‹†ˆõ Simin Naaseh Principal, Forell/Elsesser Engineers, Inc.
”‹Œ´@•qs ¼¼ŒšÝiŠ”j‹ZpŒ¤‹†Š@ŒW’· Charles C. Peck Research Staff Member, IBM T.J. Watson Research Center
•zŽR@—T”V ŽO•HdH‹ÆiŠ”j‚»Œ¤‹†ŠŒ´Žq—͐„iŒ¤‹†Žº@ŽåÈŒ¤‹†ˆõ Ellen Rathje Assistant Professor, Department of Civil Engineering, University of Texas, Austin
‰®”H‰º@—º ‘听ŒšÝiŠ”j‹ZpŒ¤‹†ŠŽ©‘RŠÂ‹«•”¶•¨HŠwŒ¤‹†Žº@ŒW’· Kenneth H.Sandhage Professor, Dept.of Materials Science and Engineering, Ohio State University
ŽR“c@˜a•F Ž­“‡ŒšÝiŠ”j¬–xŒ¤‹†Žº@Žå”CŒ¤‹†ˆõ Erik R.Scott Senior Staff Scientist, Medtronic Inc.
‰¡ŽR@Žm‹g —X­È’ʐM‘‡Œ¤‹†ŠŠÖ¼æ’[Œ¤‹†ƒZƒ“ƒ^[@Žå”CŒ¤‹†Š¯ Mrityunjay Singh Chief Scientist, Dynacs Engineering Co. NASA Glenn Research Center
‹g–ì@Š® Z—F“d‹CH‹ÆiŠ”jŒo‰cŠé‰æ•”ƒCƒ“ƒ^[ƒlƒbƒgŽ–‹ÆŠJ”­Žº@Žå¸ Miroslaw J.Skibniewski Professor, School of Civil Engineering, Purdue University
“n粁@”ü‘ãŽq iŠ”j“ŒŽÅŒ¤‹†ŠJ”­ƒZƒ“ƒ^[Œ¤‹†Šé‰æŽº@Œo‰c•ÏŠvƒGƒLƒXƒp[ƒg Jackie Y. Ying Associate Professor, Department of Chemical Engineering,Massachusetts Institute of Technology
Œà@’q[ ˆïé‘åŠwHŠw•”“sŽsƒVƒXƒeƒ€HŠw‰È@•‹³Žö