HOMEScholor>Masaaki Ichiki

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【Research Theme】

Nano scale packaging technology for nano electrical components using release, transfer, bonding of thin film capacitors with on nano-lattice control Masaaki Ichiki

Masaaki Ichiki

The University of Tokyo, Department of Precision Engineering, School of Engineering, Associate Professor

http://www.su.t.u-tokyo.ac.jp/en/index.html

The target of this research is to establish the packaging and microsystem technology for the next generation micro electronics devices and its manufacturing processes. We will clarify the high-dielectric constant thin film based on the lattice matching/mismatching techniques including its basic mechanisms. Release, transfer and bonding process will be the most essential factors in the proposed method.


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